MediaTek launches new system-on-chips for 5G smartphones

Semiconductor company MediaTek has released Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring enhanced technology to premium 5G smartphones

MediaTek has launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring enhanced technology such as connectivity, displays, gaming, multimedia and imaging features to premium 5G smartphones.

The company says that both chips borrow the advanced technology from MediaTek’s powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which is built on the ultra-efficient TSMC 5nm production process with an octa-core CPU.

The Dimensity 8100 integrates four premium Arm Cortex-A78 cores with speeds reaching 2.85GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75GHz.

“You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship-grade features and next-level energy efficiency to the premium smartphone market,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.

The new Dimensity 8000 series also uses MediaTek’s Open Resource Architecture to give device makers the flexibility to customize and differentiate features so they can make 5G smartphones and 5G experiences that truly stand out.

Powered by a five gigapixel per second image signal processor (ISP), the Dimensity 8000 series produces the fastest, clearest HDR photos and video in its class.

“MediaTek’s big bet on 5G dramatically expanded its global smartphone SoC volumes in the mid-tier, and the Dimensity 9000 is opening up the flagship market,” said Avi Greengart, President of market advisory firm Techsponential. “With the Dimensity 8000, MediaTek is giving smartphone vendors more options to balance performance and pricing while still offering flagship level gaming and AI capabilities.”

The features of the Dimensity 8000 series chips also include Support for up to 200MP cameras and 4K60 HDR10+ videography, as well as MediaTek’s latest noise reduction and AI-based unblur techniques in extreme low-light environments for crisp shots with enhanced details.

It also features simultaneous dual camera HDR video recording. Users can record with the front and rear cameras or two different rear lenses.

MediaTek also launches Dimensity 1300 series 

MediaTek also added the 6nm Dimensity 1300 to its 5G family. The Dimensity 1300’s HDR-ISP supports up to 200MP, and integrates MediaTek’s HyperEngine 5.0 to offer an optimal balance between performance and power for better efficiency in gaming and daily use scenarios. It comes with new AI enhancements, improving night shot photography and HDR capabilities for great image clarity.

The Dimensity 1300 integrates an octa-core CPU with an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores, along with an Arm Mali-G77 GPU and MediaTek APU 3.0 to support the latest AI capabilities.

According to MediaTek, smartphones powered by the Dimensity 8100, Dimensity 8000 and Dimensity 1300 will be available in the market in the first quarter of 2022, powering a new era of incredible 5G devices by some of the world’s biggest smartphone brands.

 

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